Keo silicone 2 thành phần H598

Model: H598
Manufacturer: QUINSON
Description: Silicone electronic potting glue sealing insulation thermal conduction power battery pack circuit board waterproof AB soft glue
This glue is a two-component silicone electronic potting glue, with sealing, insulation, thermal conductivity, high and low temperature resistance, color is divided into black, gray, transparent, and white, hardness is divided into hard glue and soft glue, the mixing ratio is also different and more products with weight specifications can be customized.
Specifications: 200g, 400g, 1kg, 2kg, 5kg, 10kg, 50kg
Color: black, white, clear, gray
Mixing ratio: 1:1, 2:1, 3:1
Operation time: about 30 minutes
Curing time: 1-10 hours for initial curing, 24 hours for full curing
Features: insulation, waterproof, thermal conductivity, confidentiality, anti-corrosion, anti-vibration, flame retardant
Application areas: various sensor potting, precision electronic module potting, lighting fixture potting, power module potting protection, etc.

H598 is a gray, low viscosity two component addition molding silicone sealant that can be cured at room temperature or heated after being mixed in a weight ratio of 1:1. It has the characteristic of faster curing at higher temperatures. This product does not produce any by-products or stress during the curing process, and will not cause stress strain on electronic devices; Applied to various electronic products for sealing and protection, it has functions such as sealing, waterproofing, insulation, thermal conductivity, flame retardancy, etc. After curing, it can be used in environments ranging from -50℃ to 200℃.
Product Features:
1. Sealing, insulation, waterproof and moisture-proof, dustproof and anti-corrosion.
2. Glue has good flowability, self leveling, and good permeability.
3. Flame retardant grade UL94-V-0, with good flame retardant effect.
4. High temperature resistance of 200℃, low temperature of -50℃, and good aging resistance.
5. Soft gel after curing, non damaging electronic components, detachable, and repairable.
6. Mix and solidify according to a weight ratio of 1:1, with simple operation and can be manually poured or automatically poured by machine.
7. After mixing, it can be naturally cured or quickly cured by heating (the higher the temperature, the faster the curing speed).

Typical Applications: Automotive electronics and modules; LED power drive module; Solar module junction box; Electric vehicle charging column module; Lithium battery pack, capacitor bank; Magnetic induction coil; Inverter power supply.

Technical Parameter:
Before Curing
Appearance and morphology: Component A: Grey liquid
Component B: White liquid
Viscosity (cps. 25℃): Component A: 3500-4500
Component B: 3500-4500
Mixing ratio: A component : B component= 100:100 (weight ratio)
Room temperature usage time (25℃): 30-50min
Forming time (h): 30℃ Forming time: 1-3 hours
25℃ Forming time: 3-5 hours
Forming time at 20℃: 5-10 hours
Curing time (25℃): 24 hours (25℃ -30 minutes)
After Curing
Appearance: Gray elastomer
Hardness (Shore A): 55-65
Thermal conductivity coefficient (W/m.K): 1.0
Elongation at break (%): 200-350
Volume resistivity (Ω · cm): ≥ 1.0 × 10 (14)
Breakdown voltage (kV/mm): 18-25
Dielectric loss angle tangent (1MHz): ≤ 4 × 10 (-3)
Dielectric constant (1.0MHz): 2.6-3.1
Operating temperature range (℃): -50 ~ 200
*The above data information is for reference only, and the specific measurement by the user shall prevail! Not used as a basis and standard for acceptance!

Usage Guidelines:

1. Before mixing: First, place component A and component B in their respective containers and stir thoroughly.

2. When mixing: The weight ratio of A component to B component should be followed at 1:1, and the mixture should be stirred evenly.

3. Bubble removal: After mixing the rubber material, it should be vacuumed for 1-3 minutes.

4. Sealing: The mixed adhesive should be poured into the poured product as soon as possible to avoid thickening and poor fluidity of the adhesive in the later stage.

5. Curing: Cure at room temperature for 24 hours, or at elevated temperature. The higher the temperature, the faster the curing speed.

Matters Needing Attention

1. The adhesive should be stored in a sealed and dry room temperature environment, and the mixed adhesive should be used up as soon as possible to avoid waste.

2. This product is not a hazardous material, but do not enter or eye contact.

3. This product is non-toxic, has good physiological inertness, and has no irritation or damage to the skin.

4. The product does not contain flammable and explosive components, and will not cause fire or explosion accidents. There are no special requirements for transportation.

5. After storage for a period of time, the adhesive will be layered; Please mix well before use, without affecting performance.

6. The following substances may hinder the solidification or non solidification of this product. Simple experiments can be conducted before use, and if necessary, the application area needs to be cleaned. (1) Incomplete curing condensed silicone adhesive. (2) Amine cured epoxy resin. (3) White wax welding or rosin welding points.